硅片精抛液

浙江新创纳自主开发出应用于8寸和12寸硅晶圆使用的精抛液。产品采用超高纯硅溶胶为原料，金属离子达到ppb级，满足晶圆加工对表面和残留颗粒的要求，已在客户端验证通过且批量供应。

性能指标

精抛液SJ-216(8寸)

抛光清洗后硅片表面金属残留均小于5E8atoms/cm2

表面质量:Ra<0.2nm 颗粒<4颗(0.1um)

稀释比:1:20

度: Nas1000ppb, Mg50pb, Als50ppb, Ks100ppb, Cas100ppb, Mns50ppb, Ti50pb, Fes50pb, Cr50pb, Ns10ppb, Cus10ppb, Zn550ppb, Ag50ppb, Pbs50ppb

精抛液SJ-221(12寸)

抛光清洗后硅片表面金属残留均小于2E8atoms/cm2表面质量:Ra<0.2nm 颗粒平均5颗(26nm)

稀释比:1:20

度: Nas1000ppb, Mg50pb, Als50ppb, Ks100ppb, Cas100ppb, Mns50ppb, Ti50ppb, Fe50pb, Cr50pb, Ns10ppb, Cu510ppb, Zn550ppb, Ag50ppb, Pbs50ppb